| 摘要 |
PROBLEM TO BE SOLVED: To provide an image automatic sorting method and its device capable of outputting information required for a countermeasure to the cause of the generation of a fault and information required for predicting the yield of an examination wafer by using the image of a defective site concerning the defect generated in the manufacturing process of a semiconductor wafer detected by a defect examination device. SOLUTION: The defect sorting device is provided with an image pickup means for picking up the image of an examinee, a defective candidate extracting means for extracting the image of a defective candidate from an image obtained by being picked up by this image pickup means, a first category sorting means for sorting the picture of the defective candidate extracted by this defective candidate extracting means to be in the first category, a second category sorting means for sorting the picture of the defective candidate extracted by the defective candidate extracting means to be in the second category and an output means for outputting the image of the defective candidate, the first category information of the defective candidate sorted by the first category sorting means and the second category information of the defective candidate sorted by the second category sorting means. |
