发明名称 |
LASER ANNEALING METHOD AND METHOD OF MANUFACTURING THIN FILM TRANSISTOR |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide an apparatus and method for manufacturing polycrystalline silicon for a thin film transistor device for use in a liquid crystal display pixel switch on a mass production basis with a good yield. SOLUTION: In the laser annealing apparatus and the method for manufacturing a thin film transistor wherein a pulse laser beam irradiates a glass substrate having an amorphous silicon semiconductor thin film deposited thereon while moving the glass substrate to thereby form a polycrystalline silicon semiconductor; a laser beam L to irradiate glass substrate O has a rectangular cross-sectional shape, the central line of the beam in its longitudinal direction is tilted by an angleθwith respect to a straight line defined by arranging zones corresponding to pixels of the glass substrate to be moved, thereby providing polycrystalline silicon having a uniform grain size.</p> |
申请公布号 |
JP2001332493(A) |
申请公布日期 |
2001.11.30 |
申请号 |
JP20000148393 |
申请日期 |
2000.05.19 |
申请人 |
TOSHIBA CORP |
发明人 |
NAKAMURA ATSUSHI;MIHASHI HIROSHI |
分类号 |
G02F1/136;G02F1/1368;G09F9/00;H01L21/20;H01L21/336;H01L29/786;(IPC1-7):H01L21/20 |
主分类号 |
G02F1/136 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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