发明名称 APPARATUS FOR HEATING WAFER AND SOAKING PLATE
摘要 <p>PROBLEM TO BE SOLVED: To provide an apparatus for heating a substrate with more uniform temperature distribution through a simple arrangement. SOLUTION: An apparatus for heating a substrate 1 in a vacuum container 5 comprises a soaking plate 8 having a substantially uniform temperature distribution on the surface upon heating, and means 10 for holding the substrate oppositely to the surface through a specified distance.</p>
申请公布号 JP2001332607(A) 申请公布日期 2001.11.30
申请号 JP20000154749 申请日期 2000.05.25
申请人 CANON INC 发明人 MUROFUSHI YASUNOBU;ARIGA TORU
分类号 H01L21/683;H01L21/205;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/683
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