发明名称 |
APPARATUS FOR HEATING WAFER AND SOAKING PLATE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide an apparatus for heating a substrate with more uniform temperature distribution through a simple arrangement. SOLUTION: An apparatus for heating a substrate 1 in a vacuum container 5 comprises a soaking plate 8 having a substantially uniform temperature distribution on the surface upon heating, and means 10 for holding the substrate oppositely to the surface through a specified distance.</p> |
申请公布号 |
JP2001332607(A) |
申请公布日期 |
2001.11.30 |
申请号 |
JP20000154749 |
申请日期 |
2000.05.25 |
申请人 |
CANON INC |
发明人 |
MUROFUSHI YASUNOBU;ARIGA TORU |
分类号 |
H01L21/683;H01L21/205;H01L21/68;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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