| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an evaporation apparatus capable of dispensing with an operation for removing metal protrusions and of realizing a simplified wafer manufacturing process by carrying out a metal evaporation process so as not to form metal protrusions from the beginning. SOLUTION: The evaporation apparatus forming a metal film on a wafer 28 by evaporating metal is equipped with an evaporation metal source 14, a wafer holder 22 holding the wafer 28 on its surface facing toward the evaporation metal source 14, and an annular member 46 provided in front of the wafer 28 facing the evaporation metal source 14 and possessed of an opening 54 which exposes the metal evaporation region of the wafer 28. The annular member 46 is equipped with annular covers (52 and 53) covering the peripheral edges of the wafer 28 and a protruding covers 55 protruding inward from the annular covers so as to previously cover a region of the wafer covered with the wafer holding pawls of a milling device for carrying out milling etching on the wafer 28 after a metal film is formed on it.</p> |
