| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable to suppress position drift between a terminal 20 and pads 12, 14 which are soldered by heating and melting cream solder 16, 18 and to improve soldered strength. SOLUTION: In soldering parts 32, 34 of the terminal 20, through holes 36, 38 are formed symmetrically about a mediator to a line segment connecting centering points 01, 02 of the soldering parts 32, 34, and the minimum internal wall surface space K11 and the maximum internal wall surface space K2 between the though holes 36, 38 which are equal to a minimum external wall surface distance P1 and a maximum external wall surface distance P2 between the pads 12, 14, are formed. In the case some part of the internal wall surfaces of the through holes 36, 38 are shifted outside from the external wall surfaces of the pads 12, 14 due to the position drift, the melted cream solder 16, 18 is spread out over the internal wall surface parts that have been shifted, which creates surface tension, and the position drift is suppressed by a force resulting from the surface tension. A solder fillet is formed on most parts of the internal wall surfaces of the though holes 36, 38 by the suppression of the position drift so that the soldered strength is improved. Further, the effect of suppressing the position drift and the soldered strength are improved by notches 40 to 54.</p> |
