发明名称 PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board with superior bonding strength, especially for bonding strength between a solder ball connecting terminal and a supporting insulating board. SOLUTION: A round or polygonal patch-shaped connecting terminal for a solder ball has at least one projected part or one cut part on the edge thereof in the printed wiring board. Alternatively, the printed wiring board has at least one projected or recessed part in the thickness direction thereof.
申请公布号 JP2001332850(A) 申请公布日期 2001.11.30
申请号 JP20000153300 申请日期 2000.05.24
申请人 HITACHI CHEM CO LTD 发明人 YOSHITOMI YASUNOBU;TAZAWA KAZUYUKI
分类号 H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K3/34
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