ENCAPSULATING STRUCTURE FOR CERAMIC ELECTRONIC PARTS

摘要

PROBLEM TO BE SOLVED: To provide an encapsulating structure for ceramic electronic parts which can satisfy both the moisture resistance and flame resistance required for the structure. SOLUTION: The encapsulating layer 3 of ceramic electronic parts is constituted to have a first resin layer 1 which is arranged to cover the surface of a ceramic elemental body 12 and composed of a non-flame-resistant epoxy resin having a superior moisture resistance and a flame-resistant resin layer 2 which is arranged on the first resin layer 1 as a second or after second intermediate layer or the outermost layer and composed of a flame-resistant epoxy resin.