| 摘要 |
PROBLEM TO BE SOLVED: To execute a regular compression bonding successfully by preventing a change in parallelism between a head and a chip and between a substrate and a substrate bearer due to dust or contamination attaching to the single wafer substrate or to the chip, and make possible the removal of the dust or the like at the same time with the regular compression bonding. SOLUTION: A regular compression bonding apparatus comprises a substrate holding stage 3 for holding the single wafer substrate 7 with the chips 6 provisionarily compression-bonded through an adhesive member such as an ACF, and for transferring the substrate between the substrate bearer 1 and head 2; an upside tape feeder 4 for passing a cleaning tape 8a through between the head 2 and chips 6; and a downside tape feeder 5 for passing a cleaning tape 8b through between the single wafer substrate 7 and substrate bearer 1. Due to this structure, the chips 6 can be thermocompression-bonded (regular compression bonding) by lowering the head 2, when a change in parallelism between the head 2 and chips 6 and between the substrate 7 and substrate bearer 1 due to the cleaning tapes 8a, 8b can be prevented to make the regular compression bonding done successfully.
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