发明名称 SUPPORT PLATE ASSEMBLY WITH SPRING TO USE TOGETHER WITH LATTICE ARRANGEMENT LAND DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a means to rapidly and easily assemble a circuit assembly using a support plate assembly with a compact spring. SOLUTION: This is a support plate assembly (100) with a spring in order to use together with a printed circuit board (52), an electric connector (70), and a lattice arrangement land device (60). The assembly (100) is equipped with the printed circuit board (52) and a support plate (102) which is constituted so as to support at least one left spring (120, 122, 124, 126). An assembly for pressing (127) retains the leaf springs (120, 122, 124, 126) in the state of given load to the support plate (102) beforehand, and a compression force (F3) is transferred from the leaf springs (120, 122, 124, 126) to the printed circuit board (52), the electric connector (70), and the lattice arrangement land device (60).
申请公布号 JP2001332368(A) 申请公布日期 2001.11.30
申请号 JP20010096032 申请日期 2001.03.29
申请人 HEWLETT PACKARD CO <HP> 发明人 HASELBY JEFFREY T;PETERSON ERIC C
分类号 H01R33/76;H01L23/32;H01R12/04;H01R12/16;H05K1/18;H05K3/32;H05K3/36;(IPC1-7):H01R33/76 主分类号 H01R33/76
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