METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To solve the problem where, when an LSI chip is multi-chip-mounted on a silicon multilayer board or on a semiconductor chip, assembly requires significant time and cost as each one LSI chip is transported one by one and mounted by a face-down method. SOLUTION: A groove is formed with a thin part at the border between LSI element units formed in LSI chips 4, and the LSI chips are collectively transported before flip-chip-connected to a semiconductor wafer 5. Cutting is performed from the rear surface of the LSI chips 4 as far as the bottom of a chip separation groove 3 worked on the LSI chips 4 using a cutting device for removing the thin part, so that the LSI chips 4 are separated into independent LSI chips 9.