TRAY FOR MANUFACTURING SEMICONDUCTOR LASER DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR LASER DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To form a protective film in a stable manner and to prevent sudden deterioration called optical damage on a semiconductor laser element regarding a manufacturing method of forming the protective film on a light-emitting end face and a light-emitting back and a tray 20 for positioning laser bars 9 of the semiconductor laser element. SOLUTION: The tray 20 used for forming the protective film has a plurality of grooves for positioning the semiconductor laser bars 9. A ratio of a depth of the tray groove and a thickness 12 of the laser bar is 0.33 to 0.80, a difference between a width 14 of the tray groove width 14 and a width 15 of the laser bar is 100 to 300μm, and an interval 16 between the tray grooves is 1 mm or more. The tray 20 used for forming a stable protective film.