| 摘要 |
PROBLEM TO BE SOLVED: To solve the problems of a bonding heater, shown on Fig. 3, being used for mounting a semiconductor chip on a multilayer board that it cannot deal with various chip sizes, maintainability is low, misalignment is caused when mounting a semiconductor chip, and a long time is required for raising the temperature to a desired level. SOLUTION: The contact heater comprises a ceramic tool for pressing an article being heated, a ceramic heater for heating the tool, a thermal insulation material for transmitting heat generated from the ceramic heater to the tool side, and a holder for joining these members integrally with other member wherein the tool, the ceramic heater, the thermal insulation material and the holder are joined removably. |
