发明名称 |
Connection arrangement e.g. for electronic component on PCB, has bearer with recess is at least partly formed near electrical connection contact and at least partly filled with electrically conductive adhesive |
摘要 |
The arrangement has a bearer (2) on which an electrical connection contact (6) is formed and an electrically conducting adhesive (5) applied to the electrical connection contact. The bearer has a recess (7) that is at least partly formed near the electrical connection contact and that is at least partly filled with the electrically conductive adhesive.
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申请公布号 |
DE10023220(A1) |
申请公布日期 |
2001.11.29 |
申请号 |
DE2000123220 |
申请日期 |
2000.05.08 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
FRANKE, MARTIN;FAIST, EUGEN |
分类号 |
H01R4/04;H01R12/50;H05K3/32;(IPC1-7):H01R4/04;H01R12/02 |
主分类号 |
H01R4/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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