发明名称 Connection arrangement e.g. for electronic component on PCB, has bearer with recess is at least partly formed near electrical connection contact and at least partly filled with electrically conductive adhesive
摘要 The arrangement has a bearer (2) on which an electrical connection contact (6) is formed and an electrically conducting adhesive (5) applied to the electrical connection contact. The bearer has a recess (7) that is at least partly formed near the electrical connection contact and that is at least partly filled with the electrically conductive adhesive.
申请公布号 DE10023220(A1) 申请公布日期 2001.11.29
申请号 DE2000123220 申请日期 2000.05.08
申请人 INFINEON TECHNOLOGIES AG 发明人 FRANKE, MARTIN;FAIST, EUGEN
分类号 H01R4/04;H01R12/50;H05K3/32;(IPC1-7):H01R4/04;H01R12/02 主分类号 H01R4/04
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