| 发明名称 |
SEMICONDUCTOR DEVICE KEEPING STRUCTURAL INTEGRITY UNDER HEAT-GENERATED STRESS |
| 摘要 |
A semiconductor device includes an elastic member which has an adhesive contact with at least one other member. The adhesive contact forces said elastic member to stay in a deformed shape different from an original shape to which said elastic member tries to return, wherein a force generated by said elastic member trying to return to the original shape serves to counteract a heat-generated stress applied to said semiconductor device.
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| 申请公布号 |
US2001045643(A1) |
申请公布日期 |
2001.11.29 |
| 申请号 |
US19990276515 |
申请日期 |
1999.03.25 |
| 申请人 |
KATOH YOSHITSUGU;NAKASEKO SHINYA;HOZUMI TAKASHI |
发明人 |
KATOH YOSHITSUGU;NAKASEKO SHINYA;HOZUMI TAKASHI |
| 分类号 |
H01L23/28;H01L21/56;H01L23/00;H01L23/12;H01L23/16;H01L23/34;(IPC1-7):H01L21/44;H01L29/40 |
主分类号 |
H01L23/28 |
| 代理机构 |
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代理人 |
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