发明名称 |
Device for packaging electronic components |
摘要 |
The invention relates to a device and a method for packaging electronic components (11) having semiconductor chips (5) by means of a mounting frame (1), which is additionally provided with a plastic grid (6) that is disposed on a plastic intermediate substrate (2), which surrounds each semiconductor chip (5) in framelike fashion and which for packaging the plurality of semiconductor chips (5) with a plastic casting composition (7) between semiconductor chips (5) and the plastic grid (6).
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申请公布号 |
US2001045641(A1) |
申请公布日期 |
2001.11.29 |
申请号 |
US20010816929 |
申请日期 |
2001.03.23 |
申请人 |
HAUSER CHRISTIAN;WINDERL JOHANN;POHL JENS |
发明人 |
HAUSER CHRISTIAN;WINDERL JOHANN;POHL JENS |
分类号 |
H01L21/56;H01L23/24;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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