Packung für parallelgeschaltete Subelemente von Halbleiteranordnungen und Herstellungsverfahren

摘要

A package for semiconductor devices (40) with plural subelements and method of packaging. Semiconductor power devices may include plural subelements (20) to increase device manufacturing yield. Each subelement is separately contacted through the lid (44) of the package by attaching a foil (32,34) to a subelement contact and depending a tab (36,38) from the foil that extends through the lid. Tabs for operative subelements can be connected external to the package, and tabs for inoperative subelements may be left unconnected or covered.