摘要 |
The inductances have windings that are not wound but produced by diffusion, implantation and so on (e.g. for semiconductors), by etching and so on (e.g. for ceramic substrates and circuit board substrates), or by printing, scoring, lasers and so on or by twisting a hollow solid body. The windings are finally divided, mounted around a ferromagnetic circuit and recombined.
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