发明名称 A PROCESS AND APPARATUS FOR PLASMA ACTIVATED DEPOSITION IN A VACUUM
摘要 <p>Plasma deposition apparatus (1) and method that allows metal or nonmetal vapor (6) to be generated by electron-beam evaporation, guides that vapor using a noble gas stream (containing reactive gases in cases of reactive evaporation), ionizes the dense directed gas and vapor stream at working pressures above about 0.0001 mbar using a hollow cathode plasma arc discharge (11), and conveys the ionized vapor and/or gas stream towards the substrate (4) for impact on the surface at energies varying from thermal levels (as low as about 0.05 eV) up to about 300 eV.</p>
申请公布号 WO2001090438(A1) 申请公布日期 2001.11.29
申请号 US2001016693 申请日期 2001.05.23
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