发明名称 Electrolyte for use in electrolytic plating
摘要 A electrolyte for use in electrolytic platinum plating that results in reduced Cl, S, or P contaminant production. The bath comprises 0.01 to 320 g/lit of platinum in the form of the platinum salt dinitrodiammine platinum, [Pt(NH3)2(NO2)2] or variants thereof and 0.1 to 240 g/lit of alkali metal carbonate M2CO3 or bicarbonate MHCO3 where M is selected from a group comprising lithium (Li), sodium (Na), potassium (K), rubidium (Rb) and cesium (Cs). A method of improving oxidation resistance of a platinum modified aluminide diffusion coating on a substrate, comprises electroplating the substrate using this electrolyte and then aluminizing the electroplated substrate at an elevated temperature to grow a platinum modified aluminide diffusion coating.
申请公布号 US2001045363(A1) 申请公布日期 2001.11.29
申请号 US20010895761 申请日期 2001.06.29
申请人 HONEYWELL INTERNATIONAL, INC. 发明人 STRANGMAN THOMAS E.;RAYBOULD DEREK;KOZLOV ALEX
分类号 C25D3/50;(IPC1-7):C25D5/54 主分类号 C25D3/50
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