发明名称 DEVICE FOR ELECTROLYTICALLY TREATING BOARD-SHAPED WORKPIECES, ESPECIALLY PRINTED CIRCUITS
摘要 The invention relates to a device for electrolytically treating board-shaped workpieces, especially printed circuits. The board-shaped workpieces (W) are guided in a vertical position through a treatment cell (BZ) that contains a treatment bath and the end walls of which are provided with vertical slots for the workpieces (W) to enter and to be discharged. The bath liquid escaping from the treatment cell (BZ) is collected and is returned to the treatment cell (BZ) via a pump and at least partially via spray tubes (SR). Said spray tubes (SR) are located at both sides of the workpieces (W) and are horizontally aligned in the direction of transport.
申请公布号 WO0134881(A3) 申请公布日期 2001.11.29
申请号 WO2000DE03884 申请日期 2000.11.06
申请人 SIEMENS AKTIENGESELLSCHAFT;DENYS, WILFRIED 发明人 DENYS, WILFRIED
分类号 C25D7/00;C25D5/08;C25D17/00;H05K3/24 主分类号 C25D7/00
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