| 摘要 |
<p>An IC device (10) has a semiconductor die (12) embedded within an encapsulating material (14), and a thermocouple (22) having a junction (24) directly attached to a surface of the die (12), (to allow accurate measurement), wherein the thermocouple (22) passes through the encapsulating material (14) for cennection to a temperature measuring circuit (not shown). A method of making the device (10) involves (a) etching away the encapsulation (14) of the device (10) to expose a surface of the die (12), (b) attaching a junction (24) of a thermocouple (22) directly onto the surface of die (12), and, (c) refilling the cavity (18) formed by the etching step with a casting compound. The device (10) is used for calibrating the chamber temperature of a test handler in which IC devices are soaked to reach a predetermined temperature prior to electrical testing.</p> |
