| 发明名称 |
Angled flying lead wire bonding process |
| 摘要 |
A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.
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| 申请公布号 |
US2001045012(A1) |
申请公布日期 |
2001.11.29 |
| 申请号 |
US20010871536 |
申请日期 |
2001.05.31 |
| 申请人 |
BEAMAN BRIAN SAMUEL;FOGEL KEITH EDWARD;LAURO PAUL ALFRED;SHIH DA-YUAN |
发明人 |
BEAMAN BRIAN SAMUEL;FOGEL KEITH EDWARD;LAURO PAUL ALFRED;SHIH DA-YUAN |
| 分类号 |
H01R43/02;B23K20/00;G01R1/067;G01R1/073;G01R3/00;H01L21/00;H01L21/48;H01L21/60;H01L21/607;H01L23/32;(IPC1-7):H01R43/00;H05K3/34 |
主分类号 |
H01R43/02 |
| 代理机构 |
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