Structured deposition of conductive polymer on conducting or insulating substrate, useful for microelectronic device e.g. transistor, involves forming thin, structured adhesion-promoting layer then polymer layer by oxidation of monomer

摘要

Structured deposition of conductive polymer on a silicon (Si), Si dioxide, metal, alloy or oxide, quartz, ceramic, polymer or paper substrate comprises: (i) giving surface a thin, covalently bound layer (I) of molecules (A) with adhesive group and head group coupled by an aryl or alkyl spacer; then (ii) forming a structured polymer layer, firmly adhering (I), by treatment with an oxidant forming polymer with molecules (B). Structured deposition of conductive polymer on a silicon (Si), Si dioxide (SiO2), metal, alloy or oxide, quartz, ceramic, polymer or paper substrate comprises: (i) giving the surface a thin, structured, adhesion promoting, covalently bound layer (I) of molecules (A) with an adhesive group and a head group coupled by an aryl or alkyl spacer with a length of 0-30 methylene units; then (ii) forming a structured polymer layer, adhering firmly to (I), by treatment with an oxidant forming polymer with molecules (B).