发明名称 |
Umarbeitungsfähige Leiterplattenbestückung mit einem Flip-Chip |
摘要 |
A reworkable circuit board assembly (10) including a flip chip (40) adapted for removal in the event of a failure and a method for fabricating the same is disclosed. The reworkable circuit board assembly (10) includes a heat sink (20) having a coefficient of thermal expansion substantially matched to the coefficient of thermal expansion of the flip chip (40). It also includes a deformable circuit board (30) having a first side and a second side, wherein the first side is secured to a side of the heat sink (20) in thermal communication therewith. The flip chip (40) is bonded to the second side of the deformable circuit board (30) without underfill or with weak bond strength underfill to facilitate removal of the flip chip (40) in the event of a rework. <IMAGE> |
申请公布号 |
DE69802146(D1) |
申请公布日期 |
2001.11.29 |
申请号 |
DE1998602146 |
申请日期 |
1998.07.08 |
申请人 |
HUGHES ELECTRONICS CORP., EL SEGUNDO |
发明人 |
LO, CHING P. |
分类号 |
H01L23/373;H01L21/60;H01L21/68;H01L25/04;H01L25/18;H05K1/02;H05K1/05;H05K3/00;H05K3/32;(IPC1-7):H05K1/02 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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