| 发明名称 |
Method for producing a reliable solder joint interconnection |
| 摘要 |
A method and an arrangement for measuring the cooling rate and temperature differential between the top and bottom surfaces of a printed circuit board. The method is intended to facilitate control over the temperature differential which is encountered between the top and bottom of the printed circuit board so as to prevent warpage thereof during the formation of solder joints in a reflow solder oven.
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| 申请公布号 |
US2001045445(A1) |
申请公布日期 |
2001.11.29 |
| 申请号 |
US20010801948 |
申请日期 |
2001.03.07 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CALETKA DAVID V.;KNADLE KEVIN;WOYCHIK CHARLES G. |
| 分类号 |
B23K3/08;H05K1/02;H05K3/34;(IPC1-7):B23K31/12 |
主分类号 |
B23K3/08 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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