APPARATUS AND METHOD FOR CONFIGURING AND INSERTING COMPONENT LEADS INTO PRINTED-CIRCUIT BOARDS
摘要
<p>Method and apparatus for inserting multi-leaded electronic components (20) into a board. The apparatus has a mandrel (16) and a ring (14) with an aperture therein and which is slidable over the mandrel (16). The ring (14) presses over the mandrel (16) thereby bending the leads (22) of the component (20) and allowing the component to be retained in the ring (14). The ring (14) then is used to position and force the leads (22) of the component (20) into through holes or apertures in a printed circuit board. In another embodiment a pusher (12) is used to press multilead electronic components (20) toward the printed circuit board.</p>
申请公布号
WO0191241(A1)
申请公布日期
2001.11.29
申请号
WO2001US16743
申请日期
2001.05.24
申请人
TRANS TRON LTD., INC.;HYDE, WILLIAM, S.;SALMON, MICHAEL, E.;DUMER, GARY, L.;FOLGMANN, MARTIN, F.
发明人
HYDE, WILLIAM, S.;SALMON, MICHAEL, E.;DUMER, GARY, L.;FOLGMANN, MARTIN, F.