| 摘要 |
<p>A method of manufacturing a semiconductor component includes forming a first layer over a semiconductor substrate, providing a mixture comprised of a first component and a second component, optically detecting a concentration of the first component in the mixture, and applying the mixture to the first layer. A chemical-mechanical polishing (CMP) system (100) for use in the method includes a vessel (110) having a first input port (111), a CMP slurry output port (113), and a CMP slurry sensing port (114). The CMP system also includes a refractometer (150) adjacent to the CMP slurry sensing port.</p> |
