Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate,申请号AU20000036376-传众专利搜索

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发明名称	Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate
摘要
申请公布号	AU3637600(A)	申请公布日期	2001.11.29
申请号	AU20000036376	申请日期	2000.05.23
申请人	I-MING CHEN	发明人	I-MING CHEN
分类号	H01L21/58;H01L23/12	主分类号	H01L21/58
代理机构		代理人
主权项
地址

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