发明名称 |
Polishing method and polishing apparatus |
摘要 |
<p>The present invention relates to a polishing method and apparatus for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. A polishing liquid Q is supplied onto a polishing cloth 11 attached on a turntable 1, and a semiconductor wafer W to be polished is held by a top ring 2. The turntable 1 and the top ring 2 are rotated, respectively. A surface, to be polished, of the semiconductor wafer W held by the top ring 2 is pressed against the polishing cloth 11 on the turntable 1 to polish the semiconductor wafer W. When the polished semiconductor wafer W held by said top ring 2 is to be removed from the polishing cloth 11 on the turntable 1, a relative speed of the turntable 1 and the top ring 2 is increased in comparison with a relative speed of the turntable 1 and the top ring 2 at a period of polishing.</p> |
申请公布号 |
EP1157783(A2) |
申请公布日期 |
2001.11.28 |
申请号 |
EP20010113008 |
申请日期 |
2001.05.28 |
申请人 |
EBARA CORPORATION |
发明人 |
TORII, HIROOMI;KOJIMA, HIROSHI;OGURA, SUGURU;ISOBE, SOICHI |
分类号 |
B24B37/07;H01L21/304;(IPC1-7):B24B37/04 |
主分类号 |
B24B37/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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