发明名称 |
PLATING METHOD, WIRING FORMING METHOD AND DEVICES THEREFOR |
摘要 |
<p>The present invention relates to a plating method for use in forming a liner for plating in a conductor-embedding fine recess that is defined in a surface of a semiconductor substrate, and an interconnection forming method for use in forming an interconnection using such a liner, and characterized by reducing an organic metal compound in a nonaqueous solvent to plate a surface of a base material with metal. The plating method can easily be used similarly to an aqueous electroless plating process and is capable of forming a defect-free sound metal plated layer on the surface of a substrate which has a fine recess or the like for embedding a conductor therein, and the interconnection forming method is capable of forming an embedded interconnection that comprises a defect-free sound electric conductor in a fine recess. <IMAGE></p> |
申请公布号 |
EP1158073(A1) |
申请公布日期 |
2001.11.28 |
申请号 |
EP20000966527 |
申请日期 |
2000.10.17 |
申请人 |
EBARA CORPORATION |
发明人 |
OGURE, NAOAKI;FUKUNAGA, AKIRA;NAGASAWA, HIROSHI |
分类号 |
C23C18/06;C23C18/08;C23C18/16;H01L21/00;H01L21/288;H01L21/768;H01L23/532;(IPC1-7):C23C18/08;H01L21/28 |
主分类号 |
C23C18/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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