| 摘要 |
<p>There is disclosed electronic apparatus contained in a heat dissipative external enclosure2. The external enclosure contains a plurality of units 4,6 each contained in a thermally conductive internal 8,10 housing providing RF isolation and mounted on a wall 7 of the external enclosure in thermal contact therewith. A wall 11 of the one or more units has a first recess 14 receiving the evaporator of a heat pipe. The heat pipe is clamped between the external enclosure and the internal housing. The condenser 22 of the heat pipe is lower, in use, than the evaporator and is received by a recess 24 in the wall 7 of the external enclosure 2 and clamped therein by a clamp member. <IMAGE></p> |
