发明名称 Laser operated seed potato cutter
摘要 A method of cutting seed potatoes prior to their planting is provided in which a laser beam is employed to slice the potatoes into the desired sized pieces. The present invention employs a plurality of laser cutting tubes and/or a multiple laser beam horizontal cutting areas which hold laser beam generating systems made up of laser beam sources that project the laser beams through the center of the cutting tubes or the cutting area and laser energy absorbers which contains the laser energy not used in the cutting process within the confines of the body of the invention. The laser beams bisect the cutting areas and as a potatoes pass through it the laser beams effectively cut the potato into the desired size before it leaves the body of the present invention. Additionally, the use of a laser to cut seed potatoes prior to their planting also cauterizes the cut surfaces of the potatoes which ensures that any diseases contained within an individual seed potato will not be passed to additional potatoes during the cutting process.
申请公布号 US6321484(B1) 申请公布日期 2001.11.27
申请号 US19990365981 申请日期 1999.08.02
申请人 ZELINSKI, JR. WILLIAM JOHN;TALLACKSON THOMAS KEITH 发明人 ZELINSKI, JR. WILLIAM JOHN;TALLACKSON THOMAS KEITH
分类号 A01C1/00;A23N15/00;(IPC1-7):A23N15/02 主分类号 A01C1/00
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