| 摘要 |
A flip-chip integrated circuit die includes a semiconductor substrate, electronic components implemented on the semiconductor substrate, several plural metal layers, wires routed between the electronic components on the metal layers, a top layer, and bump pads arranged in a hexagonal array on the top layer. According to another aspect, the invention is directed to flip-chip integrated circuit design, in which a circuit description is input and standardized cells which correspond to electronic components in the circuit description are obtained. The standardized cells are laid out on the surface of the die using a rectangular-based layout technique, and bump pads are laid out in a hexagonal array.
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