LIQUID EPOXY RESIN COMPOSITION FOR SEALING/FILLING AGENT

摘要

PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition for a sealing/filling agent having a flux function of removing oxide film from bump electrodes or the like and resin characteristics as an underfill (sealing/filling agent). SOLUTION: The liquid epoxy resin composition for use at the sealing/filling stage in the packaging of flip chips indispensably contains (A) a liquid thermosetting epoxy resin and (B) an acid anhydride to function as a hardener for the liquid thermosetting epoxy resin, wherein an equivalent of the liquid thermosetting epoxy resin of (A) should contain 1.0-2.0 equivalents of the acid anhydride of (B).