发明名称 |
Low dielectric constant materials with improved thermal and mechanical properties |
摘要 |
New starting materials and methods are used to make materials with low dielectric constant through the processes of transport polymerization or chemical vapor deposition. The starting materials and precursors are designed to provide polymers with combined low dielectric constant, high thermal stability and high mechanical strength.
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申请公布号 |
US6323297(B1) |
申请公布日期 |
2001.11.27 |
申请号 |
US19970958057 |
申请日期 |
1997.10.24 |
申请人 |
QUESTER TECHNOLOGY, INC. |
发明人 |
LEE CHUNG J.;WANG HUI;FOGGIATO GIOVANNI ANTONIO |
分类号 |
C07C17/16;C07C22/08;C07C25/18;C07C25/22;C07C47/546;C07C47/55;C23C16/30;(IPC1-7):C08F14/18 |
主分类号 |
C07C17/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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