发明名称 Low dielectric constant materials with improved thermal and mechanical properties
摘要 New starting materials and methods are used to make materials with low dielectric constant through the processes of transport polymerization or chemical vapor deposition. The starting materials and precursors are designed to provide polymers with combined low dielectric constant, high thermal stability and high mechanical strength.
申请公布号 US6323297(B1) 申请公布日期 2001.11.27
申请号 US19970958057 申请日期 1997.10.24
申请人 QUESTER TECHNOLOGY, INC. 发明人 LEE CHUNG J.;WANG HUI;FOGGIATO GIOVANNI ANTONIO
分类号 C07C17/16;C07C22/08;C07C25/18;C07C25/22;C07C47/546;C07C47/55;C23C16/30;(IPC1-7):C08F14/18 主分类号 C07C17/16
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