| 摘要 |
A semiconductor integrated circuit device has a semiconductor chip, a plurality of input/output pads formed on the semiconductor chip, a frame on which the semiconductor chip is mounted, a plurality of inner leads arranged on the frame so as to extend radially with respect to each side of the semiconductor chip, and wires for connecting the input/output pads to the inner leads. The plurality of input/output pads are so arranged that, with respect to any two input/output pads that are connected to two adjacent inner leads, one input/output pad is placed on an imaginary line that is parallel to and a predetermined distance apart from the wire connecting the other input/output pad to the corresponding inner lead.
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