| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate for manufacturing a printed circuit board whose thickness and size can be reduced, which can b e enhanced in density and decreased in thickness of wirings with good heat resistance, adhesive properties, durability and dimensional accuracy, and a method for manufacturing a build-up printed circuit board using it. SOLUTION: The laminate comprising an epoxy resin composition layer having a glass transition temperature of 150 deg.C or higher after curing and formed on one or both surfaces of heat resistant film having a surface oxygen atom content measured according to an X-ray photoelectron spectroscopy method (XPS) of 15% or more is manufactured, and the build-up printed circuit board is manufactured by using the laminate. |
