发明名称 PHOTO-REACTIVE HOT MELT ADHESIVE COMPOSITION AND ITS METHOD OF MANUFACTURING AND METHOD OF ADHESION
摘要 PROBLEM TO BE SOLVED: To provide a photo-reactive hot melt adhesive composition not liable to deteriorate during manufacturing, storage, painting, and pasting, and good in heat stability of the final cured product. SOLUTION: This photo-reactive hot melt adhesive composition comprises a resin prepared by reacting a carboxyl group at the end of a polyester and a multifunctional epoxy compound, and a photo-cation polymerization initiator.
申请公布号 JP2001329242(A) 申请公布日期 2001.11.27
申请号 JP20000155086 申请日期 2000.05.25
申请人 SEKISUI CHEM CO LTD 发明人 MIYAKE TAKESHI;HASEGAWA TAKESHI;KURODA TAKEO;MATSUDA MASANORI
分类号 C09J163/00;C09J167/00;(IPC1-7):C09J163/00 主分类号 C09J163/00
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