| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for bonding ceramics substrates without dislocation of the substrates, without protruding an adhesive of the substrates and without generating bubbles on the interface, and to provide a bonding jig used for the method. SOLUTION: This bonding jig (10) used for the method for bonding comprises an adhesive sheet (1) foaming an adhesive layer and facilitating the peeling from an adhered when a prescribed heating temperature is attained, a positioning member (3) bonded onto the adhesive sheet (1), comprising an adhesive absorbent material and formed and processed into a prescribed shape and a sliding member (4) freely slidably inserted into at least two sites of the positioning member (3).
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