| 摘要 |
In a surface-acoustic-wave (SAW) device and method of fabricating the same, a SAW chip is flip-chip mounted in a package. The package has a window facing an electrode formed surface of the SAW chip. After the SAW chip is mounted, the in-process item is inserted into reactive ion etching equipment, with the window open. The substrate or electrodes of the SAW chip is etched by an etching gas introduced into the ion etching equipment. Films may be formed on the electrode formation surface, in place of etching. Thus, variation in characteristics stemming from variations in manufacturing processes can be suppressed.
|
