| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing a semiconductor excellent in moldability, flame retardancy, characteristics in high-temperature preservation, moisture proof reliability and solder crack resistance without containing a halogen-based flame retardant and an antimony compound. SOLUTION: This epoxy resin composition for sealing the semiconductor is characterized in that the composition consists essentially of (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler, (E) a phosphazene compound and (F) zinc borate (2ZnO.3B2O3.3.5H2).
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