| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead-free solder compatible semiconductor sealing epoxy resin composition providing a cured product excellent in soldering crack resistance, in high temperature stability, and in moisture resistance reliability, and to provide a semiconductor device sealed by the composition, and a method for packaging the semiconductor device. SOLUTION: The lead-free solder packaging compatible semiconductor sealing epoxy resin composition indispensably comprises (a) an epoxy resin, (b) an epoxy resin curing agent, and (c) an inorganic filler. The cured product exhibits a coefficient of moisture absorption of 0.2% or less after 72 hours at relative humidity of 85% and temperature of 85 deg.C and looses weight by 0.5% or less after 5 hours in 240 deg.C air. A semiconductor device sealed in the resin composition and the method of packaging the semiconductor device are also provided.
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