发明名称 |
Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
摘要 |
The present invention is a semiconductor device capable of relieving thermal stress without breaking wire. It comprises a semiconductor chip (12), a solder ball (20) for external connection, wiring (18) for electrically connecting the semiconductor chip (12) and the solder ball (20), a stress relieving layer (16) provided on the semiconductor chip (12), and a stress transmission portion (22) for transmitting stress from the solder ball (20) to the stress relieving layer (16) in a peripheral position of an electrical connection portion (24a) of the solder ball (20) and wiring (18).
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申请公布号 |
US6323542(B1) |
申请公布日期 |
2001.11.27 |
申请号 |
US19990142856 |
申请日期 |
1999.03.26 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
HASHIMOTO NOBUAKI |
分类号 |
H01L21/60;H01L23/31;H01L23/485;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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