发明名称 Package for sealing an integrated circuit die
摘要 A die has a part that is sealed with a cap. The seal can be hermetic or non-hermetic. If hermetic, a layer of glass or metal is formed in the surface of the die, and the cap has a layer of glass or metal at a peripheral area so that, when heated, the layers form a hermetic seal. A non-hermetic seal can be formed by bonding a cap with a patterned adhesive. The cap, which can be silicon or can be a metal paddle, is electrically coupled to a fixed voltage to shield the part of the die.
申请公布号 US6323550(B1) 申请公布日期 2001.11.27
申请号 US19950471748 申请日期 1995.06.06
申请人 ANALOG DEVICES, INC. 发明人 MARTIN JOHN R.;ROBERTS, JR. CARL M.
分类号 G01P1/02;(IPC1-7):H01L23/12 主分类号 G01P1/02
代理机构 代理人
主权项
地址