Implantable medical device having an improved electronic assembly for increasing packaging density and enhancing component protection

摘要

An implantable cardiac stimulation device having an improved multi-level electronic module is disclosed. The multi-level module comprises at least two stacked internal substrates for mounting electronic components within a confined region formed between the two stacked substrates. Placement of the two stacked substrates creates an opening establishing fluid communication between the confined region and an exterior of the electronic module. A polymer dielectric coating, such as parylene, is vapor deposited over the entire electronic module which penetrates the confined region via the opening. The parylene provides enhanced protection against dielectric breakdown between the electronic components and their interconnections thereby enabling smaller separation distances between the electronic components. The parylene also provides support for the electronic components and their interconnections while acting as a moisture barrier and a particle getter.