发明名称 Method and apparatus for coating conductive metal onto an electrode for surface mounting chip components
摘要 A method for coating conductive metal onto a electrode comprises a step of adhering a tape onto a first side of a tooling plate, a step of shaking electrodes to be fell into respective guiding holes of the tooling plate and to be held at first ends of the electrodes, a step of pre-pressing second ends of the electrodes in the guiding holes of the tooling plate, a step of holding the tooling plate with a vacuum holder to dip the second ends of the electrodes down into a liquid conductive metal trough, a step of re-dipping the tooling plate into the liquid conductive metal trough for modifying shapes of the first ends of the electrodes, a step of baking the second ends of the electrodes, a step of adhering another tape onto a second side of the tooling plate and removing the tape at the first ends of the electrodes, a step of pre-pressing the first ends of the electrodes, a step of holding the tooling plate with the vacuum holder to dip the first ends of the electrodes into the liquid conductive metal trough, a step of baking the first ends of the electrodes, and a final step of tearing off the tape.
申请公布号 US6322855(B1) 申请公布日期 2001.11.27
申请号 US20000563962 申请日期 2000.05.03
申请人 SCHMIDT SCIENTIFIC TAIWAN LTD. 发明人 LIAO TZUNG-PIN
分类号 H01G13/00;(IPC1-7):B05D1/18;B05D1/32;B05D1/38;B05D3/02 主分类号 H01G13/00
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