| 摘要 |
A semiconductor device with a dummy wiring pattern. The semiconductor device is capable of stabilizing the adhesively bonding state of a semiconductor element in which a semiconductor element is mounted on the printed circuit board. The printed circuit board includes a wiring pattern and an element mounting portion on which the semiconductor element is to be mounted and is fixed using an adhesive, wherein a dummy wiring pattern having a thickness nearly equal to that of the wiring pattern is provided on the element mounting portion and the semiconductor element is mounted on the dummy wiring pattern via the adhesive.
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