Die collet for a semiconductor chip and apparatus for bonding semiconductor chip to a lead frame

摘要

A die collet for a semiconductor chip having an exposed electrical structure, the die collet including a body having a vacuum line connected thereto, the die collet including a plurality of parts each having a vacuum hole communicating with the vacuum line. Apparatus for bonding a semiconductor chip to a lead frame, the apparatus including a first die collet for picking up the semiconductor chip, on aligning stage for receiving the semiconductor chip from the first pickup tool and aligning the semiconductor chip. A second die collet picks up the semiconductor chip from the aligning stage and places the semiconductor chip on a lead frame. The first and second die collets are constructed as described above.