发明名称 |
SOLDER FOR PALLADIUM AND ITS ALLOYS |
摘要 |
metallurgy; precious metal-based soldering alloys. SUBSTANCE: invention relates to soldering palladium and its alloys and it designed for use in manufacture of jewellery. Invention provides coincidence of purity of base metal and soldered joint at preservation of their color identity in jewellery. Hardness of solder does not exceed hardness of soldered alloy. For this purpose solder includes zinc at the following ratio of components, mass %: palladium -50.0 - 50.5; solver 1.0- 45.0; copper 1.0-43.0; silicon 0.1-6.0; zinc - up to 3.0. Summary content of silver and copper does not exceed 49 mass %. EFFECT: improved quality of soldered joint. 1 tbl, 1 dwg
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申请公布号 |
RU2176180(C1) |
申请公布日期 |
2001.11.27 |
申请号 |
RU20000123318 |
申请日期 |
2000.09.07 |
申请人 |
J ZAVOD PO OBRABOTKE TSVETNYKH METALLOV";EKATERINBURGSKI AOOT |
发明人 |
TIMOFEEV N.I.;ERMAKOV A.V.;GROKHOVSKAJA L.G.;KLJUEVA I.B.;KUZ'MENKO G.F.;SIVKOV M.N. |
分类号 |
B23K35/30;(IPC1-7):B23K35/30 |
主分类号 |
B23K35/30 |
代理机构 |
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