发明名称 LAMINATED SHEET AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a copper-clad laminated sheet reduced in warpage after etching. SOLUTION: Copper foils are arranged to both outermost surfaces of a layer comprising one or more prepregs impregnated with a PTFE resin and a molten fluoroplastic resin with a melt viscosity of 101 poise or less is arranged between the prepreg layer and the copper foils and the whole is molded under pressure so that each of the molten fluoroplastic resin layers becomes a thickness larger than 2μm but twice or less the thickness of each copper foil.
申请公布号 JP2001328205(A) 申请公布日期 2001.11.27
申请号 JP20000148439 申请日期 2000.05.19
申请人 NIPPON PILLAR PACKING CO LTD 发明人 HASHIMOTO SATORU;KANZAKI HITOSHI;ONISHI KAKUJI;ICHINO YASUHIKO;TANII TOSHIMITSU;NAKAI TOSHIHARU
分类号 C08J5/24;B29C43/18;B32B15/08;B32B15/082;H05K1/03;(IPC1-7):B32B15/08 主分类号 C08J5/24
代理机构 代理人
主权项
地址